
In the modern electronics industry, thermal management of high-power and high-frequency electronics is a key challenge. With the continuous development of power semiconductors, RF devices and optoelectronic products, the choice of materials plays a crucial role in the reliability and heat dissipation performance of the package. Molybdenum-copper alloy (Mo-Cu) has become one of the important materials in the field of electronic packaging due to its excellent thermal conductivity, low coefficient of thermal expansion (CTE) and good mechanical strength. Molybdenum copper…