
High power electronics and circuits generate a lot of heat during operation. The heat sink materials help to eliminate the heat of the chip, transfer it to other media, and maintain the stable operation of the chip. Tungsten-copper and molybdenum-copper alloy are the most common heat sink materials, which are a kind of heat sink substrate commonly used for high airtight packaging such as CPU, IC, solid microwave tube. This material has a thermal expansion coefficient and high thermal conductivity…